Lead-on-chip semiconductor package and its manufacture

PROBLEM TO BE SOLVED: To provide a lead frame package for a lead-on-chip semiconductor having notched lead fingers for eliminating mechanical shearing stresses from the peripheral edge of a semiconductor chip. SOLUTION: Facing rows of nearly flat cantilever lead fingers 60 are fitted by thermal contact to the active surface of a chip with a double coated adhesive tape 55. A lead frame is extended along individual paths on the active surface of the chip so that the lead frame can cover a large surface area and can facilitate head radiation. The wiring bonding connections between the lead fingers and the chip are performed in a central connecting area extended to the center of the chip. Each cantilever lead finger has a notched section 66 positioned immediately above the peripheral edge of the chip which is apt to be damaged so as to reduce thermal and mechanical shearing stresses from the peripheral edge.