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Fluorine and Oxygen Monitoring in Plasma CVM Etching Process for Silicon Wafer by Argon Actinometry Technique
Fluorine and Oxygen Monitoring in Plasma CVM Etching Process for Silicon Wafer by Argon Actinometry Technique
2004
Yasushi Oshikane
Akihiko Nagao
Kazuya Yamamura
Akinori Oda
Katsuyoshi Endo
Keywords:
Actinometer
Oxygen
Etching (microfabrication)
Plasma
Argon
Analytical chemistry
Fluorine
Wafer
Relative density
Chemistry
Correction
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