Semiconductor device and manufacturing method thereof, electronic apparatus, and the electronic component

A semiconductor device and a manufacturing method thereof, electronic apparatus, and the electronic component, to improve the connection reliability between the wiring board and the semiconductor component. A wiring substrate 11 having the first electrode pad 14 to the A surface, provided upright on the wiring substrate 11, a circuit board 30 having a wiring 31 connected to the first electrode pad 14 , by a semiconductor device having a semiconductor package 20 having provided opposite to the wiring board 11 via the circuit board 30, the second electrode pad 19 connected to the wiring 31 on the surface. .FIELD 8