Thermal Simulation Analysis of Carrier Module Electronic Components Applied in Downhole Safety Valve Control System

With the depth of the oil well becoming deeper and the ambient temperature increasing, the high temperature environment will lead to the failure of common electronic components. In this paper, the downhole carrier module is taken as the research object, and the highest temperature is located at the chip. Firstly, the heat dissipation analysis model of carrier module is established to analyze the main heat transfer modes, mainly heat convection and conduction modes. Then, the boundary conditions such as ambient temperature and pressure are set, and FloTHERM software is used to analyze the heat dissipation of the carrier module. The simulation results show that the maximum temperature of the chip is 109 °C, which provides a basis for selecting the appropriate carrier module.