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Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications
Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications
2003
Patricia F. Mead
Aravind Ramamoorthy
Shapna Pal
Zak Fathi
Israr Ahmad
Keywords:
Electronic engineering
Delamination
Engineering
Flip chip
Silicon
Microwave
Optoelectronics
Correction
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