A method for manufacturing of optoelectronic semiconductor devices and opto-electronic semiconductor device

In at least one embodiment, the method for manufacturing optoelectronic semiconductor devices (1) is established. The method comprises the steps of: A) creating a blank (21) by means Strangzug or extrusion from a molten material, B) forming the blank (21) (in a strand-shaped optical system 2) having a longitudinal axis (A) and having a mounting side (23) and a light outlet side (22), C) forming conductor tracks (4) on the mounting side (23), D) mounting a plurality of (of the optoelectronic semiconductor chip 3) to the mounting side (23) of the optic (2) and connecting to the conductor tracks (4), and E) dicing the optics (2) to the optoelectronic semiconductor components (1), wherein the optoelectronic semiconductor components (1) each comprise at least two of the semiconductor chips (3) and the optics (2), the mechanically load-bearing component of the semiconductor devices (1).