Recent advances in polymer-based thermal interface materials for thermal management: A mini-review

Abstract With the development of high frequency and high integration of electronics such as 5G technology, overheating problem becomes an increasingly challenging problem. To address this pressing issue, the designs and innovations of high-performance polymer-based thermal interface materials (TIMs) with excellent heat dissipation ability are urgently demanded. This review summarizes the physical fundamentals, typical types and current status of polymer-based TIMs. We put emphases on the practical application requirement of TIMs, and the strategies for enhancing through-plane thermal conductivity and reducing thermal contact resistance. Perspectives on further research are provided, which will be beneficial to further understand the working mechanisms, advanced processing strategies and practical applications of polymer-based TIMs.