Integrated Laser Attach Technology on a Monolithic Silicon Photonics Platform

We report the hybrid flip-chip integration of III-V laser on a monolithic silicon photonics (SiPh) platform. Wafer-scale laser attach was demonstrated with the assistance of a laser cavity on a Si substrate. The attach process was accomplished through precise optical and mechanical alignment features on the laser and SiPh wafer. Efficient laser-to-photonic integrated circuit (PIC) butt-coupling with optical power up to 11 dBm was achieved through a combination of precise mechanical stops and optical alignment features. Key laser performance metrics such as mode hopping and relative intensity noise (RIN) vs. reflectivity were also studied. The impact of laser-PIC alignment on the coupling efficiency was studied through comprehensive two-dimensional (2D) and three-dimensional (3D) numerical modeling. Simulations were also performed to explore different coupler designs for optimized laser coupling performance.