Monolithic flip-chip compatible twin-IQ Mach-Zehnder modulators for hybrid assembly onto high capacity optical transmitter boards

This paper reports on the first development, fabrication, and characterization of monolithic InP-based twin-IQ Mach-Zehnder modulator chips as basic building blocks for future high capacity and large scale planar optical Silica-on-Si transmitter boards. The monolithic devices are designed for hybrid assembly by utilizing passive chip alignment techniques in combination with flip-chip bonding technology. Electrical GSG and GS transmission lines have been integrated and connected on InP-based modulator chips for the first time. Very compact and low loss twin-IQ modulators have been demonstrated. Small signal response measurements taken on chip level reveal an overall data chip capacity of 100 Gb/s.