Modelling Defects of Unhardened Adhesives Resulting from Handling and Warpage

The focus of this work is capturing the generation of instabilities in bondlines of uncured adhesives using the finite element method. Two geometries have been studied, a cylindrical probe and a specimen representative of a possible adhesive line used in the automotive production. Such geometries have been analyzed under tensile loading considering different width/thickness aspect ratios. A Neo-Hookian material model was chosen to describe the behavior of the material and the formation of instabilities during the process. A discretization and a parametric study have been performed to show the validity of the model and the results have been found to agree with results found in literature.