Semiconductor device and method of manufacturing same

A semiconductor device has a sensor unit (10) including a sensing part (16), and a semiconductor substrate (63). The semiconductor substrate (63) is bonded to the sensor unit (10) through an insulation film (64) such that the sensing part (16) is disposed in an air-tightly sealed chamber (70) provided between a recessed portion (66) of the semiconductor substrate (63) and the sensor unit (10). A surface (61) of the semiconductor substrate (63) provided on a periphery of the recessed portion (66) includes a boundary region (61a) at a perimeter of the recessed portion (66) and a bonding region (61b) on a periphery of the boundary region (61a). The bonding region (61b) has an area greater than an area of the boundary region (61a). The bonding region (61b) of the semiconductor substrate (63a) is bonded to the sensor unit (10) through the insulation film (64).