Structure and method for packaging light-emitting diodes

An embodiment of the invention discloses a structure and method for packaging light-emitting diodes. When the structure and method for packaging light-emitting diodes is used for high-resolution display applications, the structure and method for packaging light-emitting diodes reduces wiring difficulty and simultaneously reduces requirements for number of layers and accuracy of a printed circuit board (PCB). The structure comprises a packaging element, a power supply module for providing electric energy to the packaging structure, a ground wire and a data bus for transmitting data information. The packaging element comprises N light-emitting diode chip groups and driving chips for controlling the N light-emitting diode chip groups, the N light-emitting diode chip groups are connected with the driving chips, and N is a positive integer.