Dielectric Properties and Microstructure of BaO-Nd2O3-Bi2O3-TiO2 Microwave Ceramics with Li2O-B2O3-SiO2

Low temperature co-fired ceramics (LTCC) technology becomes crucial in the development of various modules and substrates in electronic packaging, especially in wireless and microwave applications [. With this technology, passive components (such as capacitors and inductors) can be embedded into substrates, and co-fired with high-conductive metals (such as silver and copper) below 900°C. Therefore, the shringkage and dielectric properties of LTCC are of great importance to the performance of components. So far, ceramic/glass composites have been widely researched for LTCC application due to tailored physical properties and low sintering temperature [2-3].