Etching and removing apparatus backside edges of the film for the back edge of the crystal etching method

The present invention provides a method and apparatus for removing etching the backside of the backside edge of the edges of the film etching method. The etching apparatus according to the present invention comprises: shielding the bezel, the bezel and a bottom shield side shield baffles; wherein the shield covers the upper surface of the baffle plate to be etched wafer; at the side surface of the shield cover flap It is etched side surface of the wafer; baffle shield disposed on a bottom side of the base portion for supporting a wafer to be etched, so that the bottom of the base and the cover shield guides to be etched with a crystal the center of the circle of the region of the surface. Further, according to the present invention, the back edge of the crystal etching method comprising: performing an atomic layer of an oxide thin film is deposited on the wafer; wafer after an oxide film is deposited atomic layer is disposed to the backside edge etcher station; rear edge of the grain etcher station backside etching is performed to remove the film.