The polishing composition

The polishing composition of the present invention comprises: a chemical formula HO- (EO) a - (PO) b - (EO) c -H are block type polyether represented by silica, a basic compound, hydroxyethyl cellulose and polyvinyl alcohol and at least any one of water. In the above formulas, EO represents an oxyethylene group, PO represents an oxypropylene group, a and c represent the degree of polymerization of ethylene oxide, b represents the polymerization degree of propylene oxide, a, b and c are each an integer of 1 or more .