A process for separating a wafer into chips

The invention relates to a process for the production of chips (13) by dividing a wafer longitudinal dimensions of the die defining the dividing lines (11, 12), a focus (18) of a preferably pulsed laser radiation (16) along the division lines on a first and at least one second path (25, 26) is moved within the wafer body, the laser treatment of the wafer from a rear side (17) is carried out of the wafer, and the power density for the generation of voids (28) on the first path (25) is less than the power density for generating the voids (29) on the second path (26) and / or the number of defects on the first path is less than the number of defects on the second path.