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Carrier Engineering of Bulk Bi0.5Sb1.5Te3Thermoelectric Properties by Copper Inclusion
Carrier Engineering of Bulk Bi0.5Sb1.5Te3Thermoelectric Properties by Copper Inclusion
2015
T. W. Lan
C. C. Chang
Y. C. Chien
C.M. Tseng
Y.T. Hsieh
Y.R. Wu
M H Wen
T. K. Lee
M.K. Wu
Y. Y. Chen
Keywords:
Copper
Materials science
Inorganic chemistry
Chemical engineering
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