Chemical etching device for making ultrathin silicon wafer

The utility model relates to a chemical etching device for making an ultrathin silicon wafer, comprising a double layer container, a multilayer tower and a heating assembly. The double layer container comprises an internal layer container and an external layer container; a chemical etching solution is accommodated in the internal layer container, and the internal layer container is rotatable relative to the external layer container and is arranged in the external layer container; the multilayer tower is fixedly arranged on the external layer container and is immersed in the chemical etching solution in the internal layer container; and the heating assembly is arranged between the internal layer container and the external layer container. According to the chemical etching device for making an ultrathin silicon wafer, the fluidity of the chemical etching solution is increased, the chemical etching solution is heated, thereby the activity of the chemical etching solution is enhanced, the efficiency for peeling the metal level attached to the ultrathin silicon wafer is greatly increased, the cost is low, and large-scale production is promoted.