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3D Chip Stacking of RF Devices with Cu TSV, Cu/Sn Bumps and Sealing Ring
3D Chip Stacking of RF Devices with Cu TSV, Cu/Sn Bumps and Sealing Ring
2011
W. Zhang
B. Majeed
X. Sun
G. Posada
C. Diekmann
C. Eggs
Edgar Schmidhammer
W. De Raedt
Keywords:
Stacking
Three-dimensional integrated circuit
Materials science
Composite material
Optoelectronics
Correction
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