Structure, rheological, thermal conductive and electrical insulating properties of high-performance hybrid epoxy/nanosilica/AgNWs nanocomposites

A facile and effective approach by incorporating silica nanoparticles (SNPs) to fabricate high performance epoxy-based electronic packaging materials which are both thermally conductive and electrically insulating was presented. Because of the strong interaction between SNPs and silver nanowires (AgNWs), uniformly dispersed SNPs-modified epoxy was employed to promote the dispersion of AgNWs in epoxy matrix. Further, the enhanced modulus of epoxy matrix by the incorporation of SNPs effectively alleviates the modulus mismatch between stiff AgNWs and epoxy matrix. Compared with epoxy/AgNWs composites without SNPs, the resulting hybrid materials, that is, epoxy/SNP/AgNWs, showed distinct improvements in thermal conductivity without degrading their mechanical properties. Also, the SNPs were absorbed onto the surface of AgNWs forming an electrical insulation layer to disrupt the electron flows between adjacent AgNWs, hence retaining the electrical insulation of epoxy matrix. Finally, this new fabrication method is easily scalable owing to its simple procedure and use of commercial well-dispersed SNPs-modified epoxies.