Improved dielectric and mechanical properties of polyolefin based laminates via surface modification silicon dioxide

The rapid development of 5G technique needs higher requirements for laminate under high-frequency condition. In this work, silicon dioxide (SiO2) surface modified by y- aminopropyl triethoxysilane (KH-550) was used as fillers to improve the dielectric and mechanical properties of polyolefin-based laminates. A relative low dielectric constant of 3.61 and dielectric loss of 3.69 × 10−3 at 10 GHz is observed for the laminate with 55 wt% K-SiO2. Moreover, the as-obtained laminate exhibits optimum mechanical properties. These results indicated that the K-SiO2 (surface modified by KH-550)/polyolefin laminate is an ideal candidate for high-frequency substrate.