Heat absorbing member, a cooling device and electronic equipment

The printed circuit board 1, electronic components back of different heights (CPU element 2a and the capacitor 2b and the coil elements 2c) is mounted. Most spine is in contact with the upper surface of the lower CPU element 2a, in a manner in contact with the side surface of the capacitor 2b and the coil elements 2c, heat absorbing member 3 is provided above the printed circuit board 1. The heat absorbing member 3, the flow passage 4 for circulating a cooling medium is formed. Heat generated by the CPU element 2a is transmitted to the cooling medium flow path 4 via the heat absorbing member 3 from the upper surface, the capacitor 2b, heat generated in the coil element 2c via the heat absorbing member 3 from the side It is transmitted to the cooling medium in the flow path 4.