Old Web
English
Sign In
Acemap
>
Paper
>
Development of a dicing process for 4H-SiC wafers by Plasma Chemical Vaporization Machining (PCVM) using a metal slit mask
Development of a dicing process for 4H-SiC wafers by Plasma Chemical Vaporization Machining (PCVM) using a metal slit mask
2020
Yuma Nakanishi
Risa Mukai
Satoshi Matsuyama
Kazuto Yamauchi
Yasuhisa Sano
Keywords:
process
Machining
Slit
Wafer dicing
Plasma
Wafer
Vaporization
Materials science
Optoelectronics
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]