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Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions
Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions
2018
Dong-Yurl Yu
Junhyuk Son
Yong Ho Ko
Chang-Woo Lee
Jung-Hwan Bang
Keywords:
Intermetallic
Microstructure
Soldering
Metallurgy
Materials science
Correction
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