Electroplating solution for cyanide-free silver plating and cyanide-free silver plating method

The invention discloses an electroplating solution for cyanide-free silver plating and a cyanide-free silver plating method, wherein the electroplating solution is formed by preparing the following components: 40-45g/L silver nitrate, 200-250g/L sodium thiosulfate, 40-45g/L potassium metabisulfite, 20-30g/L ammonium acetate and 0.6-0.8g/L thiosemicarbazide; and the cyanide-free silver plating method mainly comprises the following steps: polishing, deoiling and activating a plating part, depositing silver plating by direct current, and passivating. The electroplating solution of the invention has excellent stability and dispersibility; by the DC deposition method, the silver coating reaches the nanoscale, which is well combined with a substrate with smooth and compact surface, good radiance, strong anti-tarnishing capability, simple process, convenient operation, low cost and capability of meeting requirement of the production field.