Bonding apparatus, ultrasonic transducer and bonding method

The invention relates to a bonding apparatus, in particular for producing bonding connections between electrical conductors in wire or strip material and contact points of substrates such as in particular of electrical circuits, wherein the bonding device comprises a to a, in particular vertical, geometrical axis of rotation (D) rotatable bonding head (2) to which a bonding tool (5) and an ultrasonic transducer (35) for ultrasonic vibration excitation of the bonding tool (5) are provided. In order to improve a bonding apparatus of the aforementioned type advantageously, it is proposed that the main extension direction (36) of the ultrasound transducer (35) and / or its direction of extension in the direction of the axis of minimum moment of inertia to the geometric axis of rotation parallel (D) of the bonding head (2) extends. According to further aspects, the invention also relates to a bonding device, or an ultrasound transducer.