The adhesive sheet and a semiconductor device and a manufacturing method

An adhesive sheet that acts as a dicing tape in a dicing process and acts as an adhesive sheet having excellent connection reliability in a joining process between a semiconductor element and a support member, a semiconductor device using the adhesive sheet, and a method of manufacturing the same The purpose is to provide. An adhesive layer containing a high molecular weight component having a weight average molecular weight of 100,000 or more and (A) an epoxy resin and an epoxy resin curing agent and (B) a functional monomer, and an adhesive layer containing a radiation polymerizable compound , And at least a base material layer, wherein the adhesive strength between the adhesive layer and the pressure-sensitive adhesive layer before irradiation is 200 mN / cm or more, and 5.1 mmΦ of the adhesive layer in an uncured or semi-cured state Provided are an adhesive sheet having a tack strength at 25 ° C. of 0.5 N or more by probe measurement, a semiconductor device using the adhesive sheet, and a manufacturing method thereof. [Selection] Figure 3