Multi-electrode CZT detector packaging using polymer flip chip bonding

Polymer#ip chip bonding has been used to package a multi-electrode CZT detector. During the packaging process the temperature of all components was kept less than 803C. The size of the conductive epoxy eontacts is less than 120 l mi n diameter. Thermal cycling, and random and structural vibration tests indicate reliable detector}substrate interconnection and rugged construction. ( 2001 Elsevier Science B.V. All rights reserved.