Micro-bump bonding apparatus

The present invention provides a micro-bump bonding apparatus, comprising a workpiece which comprises a metal bump; located directly above a portion of the above-described metal bumps, and a dielectric layer having. A portion of said surface of said metal bump and said forming a dielectric layer interface. Over a metal surface treatment of the metal bumps formed on and in contact with the metal bumps. Surface treatment of the metal below the interface extends from above the dielectric layer. The engagement structure of an embodiment of the present invention, can enhance the vulnerability of the prior art, and may improve the reliability of the bonded structure.