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C-12-45 Investigation of On-Chip Transmission Line Interconnect in Wafer Level Chip Scale Package Technology
C-12-45 Investigation of On-Chip Transmission Line Interconnect in Wafer Level Chip Scale Package Technology
2007
Akiko Mineyama
Takahiro Ishii
Makoto Kimira
Hiroyuki Ito
Kenichi Okada
Hideki Hatakeyama
Takuya Aizawa
Tatsuya Ito
Ryozo Yamauchi
Kazuya Masu
Keywords:
Optoelectronics
Chip-scale package
Chip
Transmission line
Interconnection
Wafer
Materials science
Correction
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