Measurement of Air Humidity inside Electronic Devices
2001
A nondestructive method for measuring the moisture level in the sealed glass–metal or ceramic–metal packages of integrated circuits and semiconductor devices is suggested. A circuit diagram of an in-package atmosphere dew-point temperature meter is presented. A cooling system for the electronic devices under consideration is described. The relative error and duration of one cycle of temperature measurements are ≤5% and < 25 min, respectively.
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