Old Web
English
Sign In
Acemap
>
Paper
>
Microstructural Investigation of Pulse Electroplated Copper Trenches Deposited with Organic Additives
Microstructural Investigation of Pulse Electroplated Copper Trenches Deposited with Organic Additives
2016
James Brandon Marro
Amrita Kapat
Taghi Darroudi
Chukwudi Okoro
Yaw S. Obeng
Kathleen Richardson
Keywords:
Electroplating
Engineering drawing
Metallurgy
Copper
Pulse (signal processing)
Engineering
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]