79 Mathematical Model of Adapted Ultrasonic Bonding Process for MEMS Packaging

In the paper, approach to adaptation ultrasonic bonding process for MEMS WLP is proposed. The results of the welded joint of dissimilar plates simulation are presented. Based on them, dependency between quality of the welded joint and the technological parameter of the welding speed is given. Mathematical Model of Adapted Ultrasonic Bonding Process for MEMS Packaging is developed.