Substrate for packaging body and manufacturing method thereof, and packaging body

The present invention provides a substrate for a packaging body and a manufacturing method thereof, and a packaging body. The substrate comprises a carrier plate, a first patterning conductor layer, asecond patterning conductor layer and a three-dimensional printing conductor. The carrier plate has a first surface, a second surface and a third surface; the first surface is opposite to the secondsurface, and the third surface is connected between the first surface and the second surface; the first patterning conductor layer is arranged on the first surface; the second patterning conductor layer is arranged on the second surface; and the three-dimensional printing conductor is arranged on the third surface and is connected between the first patterning conductor layer and the second patterning conductor layer. The manufacturing method comprises: a step of using a three-dimensional printing method to form a three-dimensional printing conductor on the third surface. The substrate for a packaging body and a manufacturing method thereof, and a packaging body do not need to employ a conduction hole process, can complete interconnection between the first patterning conductor layer and thesecond patterning conductor layer in a simple mode, so that the production complexity and required consumables are effectively reduced.