Packaging structure and packaging method of the tire pressure monitoring system

The present invention discloses a packaging structure and packaging method for tire pressure monitoring system, which belongs to the field of integrated circuit packaging technology, to solve the conventional large apparatus size and weight without problems facilitate a tire mounted on a vehicle designed. The package structure of the tire pressure monitoring system of the present invention comprises a substrate having a top and bottom, respectively, the sensor and the control chip is bonded to the top layer and the substrate are fixed by the fixing member, but also discrete components mounted on the top of the substrate, the silicone coating on the sensor, all of the elements on a substrate is provided by the encapsulating material encapsulating. Tire pressure monitoring system according to the present invention, a small package size, light weight, stable performance, packaging method of the present invention is a tire pressure monitoring system, a package structure, the process is simple, convenient and can be used to ensure the reliability in harsh environments.