High temperature packaging for SAW transponder

A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.