One-step fabrication of fine surfaces via femtosecond laser on sliced SiC

Abstract A one-step, facile approach of femtosecond laser polishing for achieving fine surface in sliced SiC is reported. The effect of wavelength and pulse number on formation mechanism of surface morphology and composition are studied firstly. On the basis of relationship between removal depth and defect depth, variation on surface profile investigating, fine surface is obtained by fine-tuning processing parameters. Regular grooves formed by wire saw on subsurface is eliminated completely but no damage generates. Not only that, curves of indentation indicate that quality on subsurface is improved. The improvement both in surface and subsurface benefits from small thermal effect and high machining accuracy of femtosecond laser. Homogeneous structure/composition on subsurface after polishing has higher stable friction coefficient，which will be beneficial to the subsequent ultra-precision polishing.