Resin composition, resin flake, resin flake with metal foil, cured resin flake, structural body and semiconductor device

The invention relates to a resin composition, a resin flake, a resin flake with a metal foil, a cured resin flake, a structural body and a semiconductor device for power or a light source.The resin composition comprises epoxy resin containing polyfunctional epoxy resin, a curing agent containing novolac resin with constitutional units shown in general formula (I), and inorganic filling materials containing nitride particles, wherein in the general formula (I), R1 and R2 refer to hydrogen atom or methyl independently, m ranges from 1.5 to 2.5 on a average value basis, and n ranges from 1 to 15 on a average value basis.