Using mesoscale simulation to explore photoresist line edge roughness
2005
Computer simulators are ideal tools to study complex process spaces,
but current lithography simulators are based on empirically-derived
continuum approximations and thus are unsuited for investigating
properties like line edge roughness (LER) because they do not incorporate molecular level details. A "mesoscale" simulation is
described that enables molecular level effects to be captured. This
technique is a compromise between accurate, but slow, atomic-level
simulations and the less accurate, but fast, continuum models. The
modeling of stochastic processes that lead to LER is enabled via use
of Monte Carlo techniques. Mesoscale simulation was used to study
the effects of added base quencher to overall photoresist performance. Simulations of acid/base kinetics with quencher loadings ranging from 0 to 20% show good qualitative agreement with
experimental data. Results show that decreasing aerial image quality
increases the root-mean-square (RMS) roughness, whereas increasing
base quencher loading improves LER, up to approximately 50% base. A
mechanism that explains line edge roughness stemming from acid gradients is proposed. This mechanism is supported by simulations
showing that the catalytic chain length varies inversely with acid
concentration. Simulation results show that base effectively limits
the influence of acid in low concentration regions. A critical drawback of using base additives is significantly reduced photospeed.
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