Interface evolution of TiAl／Ti6242 transient liquid phase joint using Ti, Cu foils as insert metals

The interface evolution of TiAl/Ti6242 joint produced by transient liquid phase(TLP) bonding with Ti,Cu foils as insert metals was investigated. The results show that the surface oxide layer on TiAl plays a very imporer on the surface of TiAl. The diffusion behavior of Cu atoms in TiAl is strongly controlled by the vacancies beneath the surface of TiAl. Based on the interface diffusion and interface wettability, a mechanism for the effect of bonding pressure, bonding temperature, holding time and stacking sequence of the insert foils on the joint formation process were proposed.