Interface thermal resistance induced by geometric shape mismatch: A multiparticle Lorentz gas model.

Poor heat dissipation caused by interface thermal resistance (ITR, or Kapitza resistance) has long been the bottleneck that limits the further miniaturization of integrated circuit. In this paper, different from previous studies on ITR induced by conjunction of two different materials, the ITR of a homogeneous stepped system is studied through the multiparticle Lorentz gas model. It is found that ITR can be triggered by pure geometric shape mismatch, and decreases when the degree of mismatch decreases. The ITRs for forward and backward transport are asymmetrical; thus, thermal rectification effect is also obtained in this system. Moreover, the effects of absolute width, width ratio, mean temperature, and temperature difference on ITR and thermal rectification effect are discussed. The ITR induced by geometric shape mismatch provides physics for interfacial thermal transport.