Challenges of Scalable 2.5D IC Assembly

Driven by key metrics, including higher computing performance, lower power consumption, smaller form factor, increased bandwidth, and reduced latency (interconnect delay), the semiconductor interconnect technology is transitioning to 2.5D and gaining acceptance in the industry, as an increasing number of products are beginning to enter volume manufacturing. To transition from today's low volumes to high volume manufacturing (HVM), the concerns of warpage control, thermal dissipation, cost (yield and throughput), and overall technology scalability for future generations need to be addressed rapidly. The solutions in these relatively new packaging technologies encompass design/layout, material, process, and integration choices. With these concerns as a backdrop, our article will discuss our approach to optimizing 2.5D assembly for HVM. This article starts with a review of our test vehicle and our overall choices of substrate, interposer, and die dimensions. Three different 2.5D assembly approaches that have...