Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

Abstract This paper presents thermal and electrical characterizations of an ultra-thin flexible 3YSZ (3 mol% Yttria Stabilized Zirconia) ceramic substrate to explore its potential for electronic packaging applications. The thicknesses of the ultra-thin 3YSZ substrates were 20 μm and 40 μm. The flexible thin ceramic substrate can provide not only better modulus for higher robustness in manufacturing, especially in Z-axis direction of modules, but also low thermal resistance for high density 2D (two dimensional) / 3D (three dimensional) power module packaging applications. To better understand the thermal and electrical properties of the ultra-thin flexible ceramic, different measurements were employed. Thermal conductivity was measured at different temperatures by 3-omega method, the results were verified by thermo-reflectance measurement at room temperature. Relative permittivity was measured from 100 Hz to 10 MHz, with dielectric losses determined by dielectric spectroscopy. The dielectric breakdown of t...