Cathodic arc deposition

Cathodic arc deposition or Arc-PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique can be used to deposit metallic, ceramic, and composite films. Cathodic arc deposition or Arc-PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique can be used to deposit metallic, ceramic, and composite films. Industrial use of modern cathodic arc deposition technology originated in Soviet Union around 1960–1970.By the late 70's Soviet government released the use of this technology to the West. Among many designs in USSR at that time the design by L. P. Sablev, et al., was allowed to be used outside the USSR. The arc evaporation process begins with the striking of a high current, low voltage arc on the surface of a cathode (known as the target) that gives rise to a small (usually a few micrometres wide), highly energetic emitting area known as a cathode spot. The localised temperature at the cathode spot is extremely high (around 15000 °C), which results in a high velocity (10 km/s) jet of vapourised cathode material, leaving a crater behind on the cathode surface. The cathode spot is only active for a short period of time, then it self-extinguishes and re-ignites in a new area close to the previous crater. This behaviour causes the apparent motion of the arc. As the arc is basically a current carrying conductor it can be influenced by the application of an electromagnetic field, which in practice is used to rapidly move the arc over the entire surface of the target, so that the total surface is eroded over time. The arc has an extremely high power density resulting in a high level of ionization (30-100%), multiple charged ions, neutral particles, clusters and macro-particles (droplets). If a reactive gas is introduced during the evaporation process, dissociation, ionization and excitation can occur during interaction with the ion flux and a compound film will be deposited. One downside of the arc evaporation process is that if the cathode spot stays at an evaporative point for too long it can eject a large amount of macro-particles or droplets. These droplets are detrimental to the performance of the coating as they are poorly adhered and can extend through the coating. Worse still if the cathode target material has a low melting point such as aluminium the cathode spot can evaporate through the target resulting in either the target backing plate material being evaporated or cooling water entering the chamber. Therefore, magnetic fields as mentioned previously are used to control the motion of the arc. If cylindrical cathodes are used the cathodes can also be rotated during deposition. By not allowing the cathode spot to remain in one position too long aluminium targets can be used and the number of droplets is reduced. Some companies also use filtered arcs that use magnetic fields to separate the droplets from the coating flux.