K Fuji

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Effects of dissolved hydrogen on IASCC behavior

K Fuji Hiromasa Nishioka K. Fukuya Tadahiko Torimaru

Uniaxial constant load SCC (Stress Corrosion Cracking) tests at stress levels of 376 to 752 MPa, corresponding to normalized stress of 0.4 to 0.8 {sigma}{sub y} ({sigma}{sub y}: yield strength) were conducted on cold-worked SUS316 stainless steel specimens irradiated to 38 dpa in 320 C simulated PWR primary water containing 500 ppm B and 2 ppm Li while changing dissolved hydrogen (DH) concentration of 0.5 ppm (5 cc/kg-H{sub 2}O) and 4 ppm (45 cc/kg-H{sub 2}O). Failure - non failure border stress was identified to be (0.7 - 0.8)*{sigma}{sub y} at 0.5 ppm, and (0.4 - 0.5)*{sigma}{sub y} at 4 ppm. It was confirmed from these findings and the previously obtained border stress of (0.5 - 0.6)*{sigma}{sub y} at 2.8 ppm (30 cc/kg-H{sub 2}O) that the border stress for IASCC initiation decreases as the DH concentration increases. (authors)

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新しいキラルなシフト試薬,光学活性2,2′-ジヒドロキシ-1,1′-ビナフチルおよび1,6-ジ(o-クロロフェニル)-1,6-ジフェニルヘキサ-2,4-ジイン-1,6-ジオール

Chemistry Letters (1988)

F. Toda Kenji Mori Jyōji Okada Manabu Node Ayaka Itoh

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ChemInform Abstract: THE CHEMISTRY OF DITERPENOIDS IN 1981

Chemischer Informationsdienst (1985)

Etsuko Fujita K Fuji Y. NAGAO Manabu Node Masahito Ochiai

10.1002/chin.198531370

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Measurement of Biaxial Stress by an Electrodeposited Copper Foil with a Microcircular Hole. 3rd Report. Adaptation to the Stress Concentrated Location under Biaxial Tension.

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A (1993)

Seiichiro KITAOKA Noboru EGAMI K Fuji

Although the copper electroplating method of stress analysis can only detect the shearing stress amplitude, microcircular holes made in electrodeposited copper foil enable separation and measurement of the first and second princical stresses with biaxial stress conditions of a negative biaxial stress ratio. In this paper, developing the above idea, a method of detecting both principal stresses at the stress-concentrated location with a positive biaxial stress ratio is presented. The accuracy of this method is ascertained by examining the stress state near the hole in a plate under uniaxial tension and that at the bottom of a chircular groove in a shaft under bending.

Shearing (physics)

Tension (geology)

10.1299/kikaia.59.1036

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C(3)位に第4級炭素中心を持つテトラヒドロイソキノリンとトリプトリン誘導体の容易な不斉合成

Synthesis (2003)

Takahiro Kawabata O Oeztuerk Hidenori Suzuki K Fuji

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3種の新抗しゅよう性ジテルペノイド,トリコラブダールA,C,およびD

Chemistry Letters (1982)

Manabu Node Sai M K Fuji Eiichiro Fujita T Shingu

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新しい無臭のボランキャリアーとしてドデシルメチルスルフィドとメチル(6-モルホリノヘキシル)スルフィド

Synthesis (2004)

P. K. Patra Kiyoharu Nishide K Fuji Manabu Node

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Nine Point Bending Test Technique for Understanding of Sintered Silver Die Bonding Failure Mechanism

Experimental Techniques (2023)

Keisuke Wakamoto K Fuji T. Otsuka Ken Nakahara Takahiro Namazu

Abstract The Sintered silver (s–Ag) die degradation is commonly evaluated by thermal shocked test (TST), which evaluates the material’s durability against a heating/cooling cycle. Materials with different coefficient of thermal expansion (CTE) give rise to thermal out-of-plane deformation surrounding the bonding part, which deteriorates s–Ag die part by repeated thermal and mechanical stress during TST. For the safe and reliable design of s–Ag die toward long-term durability, the contribution of thermal and mechanical stresses to degradation should be understood separately. Clarify the overall s–Ag die degradation mechanism during TST compared to the new mechanical bending test that can apply out-of-plane deformation. The authors propose a new mechanical bending test technique, called the nine-point bending (NBT) test, which can provide out-of-plane deformation with a s–Ag die-attached specimen as TST like. By comparing NBT and TST, the degradation mechanism of the s–Ag die-attach element can be understood from both thermal and mechanical aspects. In scanning acoustic tomography (SAT) analysis, a similar degradation ratio between NBT and TST is obtained, which indicates that mechanical stress plays a significant role in deteriorating s–Ag die layer in TST. After 1000 cycles, however, cracking and s–Ag material aging coexist in TST only, destabilizing s–Ag die fracture. s–Ag main degradation cause in TST is clarified with mechanical stress by comparing NBT. In addition, thermally material aging destabilized the s–Ag degradation during TST.

Degradation

Environmental stress cracking

10.1007/s40799-023-00664-y

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ハロゲン化アルミニウム-チオール系脂肪族および芳香族メチルエーテルの脱メチル化およびメチレンジオキシ化合物の脱メチル化のための有用試薬

Chemistry Letters (1979)

Manabu Node Kiyoharu Nishide Sai M Karen Ichikawa K Fuji

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