Wan Mokhdzani Wan Norhaimi

Universiti Malaysia Perlis

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Co-Authors

Zaliman Sauli

Universiti Malaysia Perlis

Vithyacharan Retnasamy

Universiti Malaysia Perlis

M. H. A. Aziz

University of Mataram

Hussin Kamarudin

Universiti Teknologi MARA

Moganraj Palianysamy

Universiti Malaysia Perlis

Aaron Koay Terr Yeow

Universiti Malaysia Perlis

Rajendaran Vairavan

Universiti Malaysia Perlis

Mukhzeer Mohamad Shahimin

National Defence University of Malaysia

Hasnizah Aris

Universiti Malaysia Perlis

Muammar Mohamad Isa

Universiti Malaysia Perlis

Cooperative Institutions

Universiti Malaysia Perlis

Universiti Teknologi MARA

University of Manchester

Silpakorn University

National Defence University of Malaysia

Iraq University College

University of Southampton

University of Mataram

Politeknik Negeri Bandung

Bandung Institute of Technology

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Citation

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Silicon Doped Boron and Glass Based Surface Bonding Strength Analysis via Anodic Bonding Approach

Advanced materials research (2014)

M. H. A. Aziz Zaliman Sauli Vithyacharan Retnasamy Hussin Kamarudin Wan Mokhdzani Wan Norhaimi

In this paper, the bondability of silicon bonded to different glass based material was studied by analyzing the bond strength comparison using the anodic bonding approach. The three types of glass based surface used were silica, pyrex, and soda lime glass. Experiments were carried out using an in-house designed anodic bonder and the bond strength were measured using a bond strength tester. Silicon will be placed on the positive terminal while the glass based materials will be placed on the negative terminal. The anodic process was done in two sets which are before and after the cleaning process for each sample. For every set, there are three different bonding partners, which are silicon with silica, silicon with Pyrex, and silicon with soda lime glass. From the results, it can be seen that majority of the samples showed higher bond strength after the cleaning process. Silicon bonded to soda lime glass showed the highest bond strength compared with other materials. This was followed by silicon to pyrex bonding and finally silicon to silica bonding. The maximum bond strength for all samples achieved in the range of 25 until 35 minutes of bonding time. After that, all samples show a critical decrease of bond strength except for the bonding process between silicon doped boron and silica. Cleaning process was proven a critical factor to achieve better bondability as shown in the higher bond strength obtained.

Anodic bonding

Soda-lime glass

Silica glass

10.4028/www.scientific.net/amr.1082.437

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Citations (0)

Bond Strength Comparison between Silicon and Glass Based Surface Using Anodic Bonding

Applied Mechanics and Materials (2014)

M. H. A. Aziz Zaliman Sauli Vithyacharan Retnasamy Wan Mokhdzani Wan Norhaimi Aaron Koay Terr Yeow

This paper reports on the bond strength comparison between silicon and different glass based materials via anodic bonding approach. The three types of glass based surface used were silica, pyrex, and soda lime glass. Silicon will be placed on the positive terminal and glass based materials will be placed on the negative terminal. Experiments were carried out using an in-house designed anodic bonder and the bond strength were measured using a bond strength tester. The anodic bonding approach process was done in two sets which are before and after the cleaning process for each sample. For every set, there are three different bonding partners, which are silicon with silica, silicon with Pyrex, and silicon with soda lime glass. From the results, it can be seen that almost all samples showed higher bond strength after the cleaning process. Silicon with soda lime glass bonding shows the highest bond strength compared with other materials.

Anodic bonding

Soda-lime glass

Silica glass

10.4028/www.scientific.net/amm.680.89

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Citations (1)

Contact Angle Analysis on Glass Based Surface

Applied Mechanics and Materials (2014)

M. H. A. Aziz Zaliman Sauli Vithyacharan Retnasamy Wan Mokhdzani Wan Norhaimi Steven Taniselass

This paper reports on the contact angle measurement analysis on a glass based surface for anodic bonding process cleaned by three distinct cleaning processes. The three types of glass based surface used were silica, pyrex, and soda lime glass. The three cleaning solutions tested in this experiment were RCA, piranha and acetone. Water Droplet Test (WDT) was done to analyze the contact angle of micro droplet on sample surface. It can be done by dropping a droplet of water in constant volume at the fixed height and angle. Only RCA process constantly decreases the contact angle value after cleaning. The compilations of data strongly proved that all samples become hydrophilic after RCA cleaning process. The solid surface is considered hydrophilic when water contact angle is smaller than 90°, and hydrophobic profile if the water contact angle is larger than 90°. Samples which undergo piranha and acetone cleaning did not prove any characteristic of hydrophilic or hydrophobic surface after cleaning.

Flat glass

Soda lime

Soda-lime glass

10.4028/www.scientific.net/amm.680.93

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Citations (5)

Breast surface coordinate variation analysis caused by round shape tumor with fringe projection profilometry

M. H. A. Aziz Mukhzeer Mohamad Shahimin Wan Mokhdzani Wan Norhaimi Rajendaran Vairavan Zaliman Sauli

Breast cancer is one of the fatal diseases and is one of the leading causes of death among women. Early screening for breast cancer is highly needed among women. Monitoring of the disease is also extremely vital for determining the best possible method of treatment. One of the most common symptoms of breast cancer is the breast surface change caused by the tumor within the breast. Shapes of the tumor vary among the patients, and some of the standard shapes of the tumor are round, oval, irregular, spiculated and microlobulated. Current common imaging modalities of diagnosing for breast tumor is the Magnetic Resonance Imaging (MRI), ultrasound and mammography. The current imaging modalities have been known to diagnose the disease but also has its limitations due to exposure concerns. In this work, the changes of breast surface are analyzed using a proposed fringe projection imaging modality. Surface changes of the breast were analyzed with the presence of a round shape tumor varied from 0.5 cm to 2 cm. The fringe projection profilometry system has successfully demonstrated its ability in detecting the pixel coordinate changes of the breast surface caused by the size variation of the tumor.

Breast tumor

Breast imaging

10.1117/12.2305230

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Citations (2)

Comparison of Bond Strength of Silicon-Silica and Silicon-Pyrex in Wafer Bonding

Advanced materials research (2014)

M. H. A. Aziz Zaliman Sauli Vithyacharan Retnasamy Hussin Kamarudin Wan Mokhdzani Wan Norhaimi

This paper reports on the bond strength comparison between silicon and different glass based materials via anodic bonding approach. The two types of glass based surface used were silica and pyrex. Silicon will be placed on the positive terminal and glass based materials will be placed on the negative terminal. Experiments were carried out using an in-house designed anodic bonder and the bond strength were measured using a bond strength tester. The anodic approach process was done in two sets which are before and after the cleaning process for each sample. For every set, there are three different bonding partners, which are silicon with silica, and silicon with Pyrex. From the results, it can be seen that almost all samples showed higher bond strength after the cleaning process. Silicon pyrex with bonding shows the highest bond strength compared to that with silicon-silica due to the presence of sodium ions. The effects of cleaning process with RCA towards the bond strength was also investigated.

Anodic bonding

Silicon dioxide

10.4028/www.scientific.net/amr.1082.416

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Citations (0)

Surface variation analysis of proximal interphalangeal joint of osteoarthritis with fringe projection profilometry

Mukhzeer Mohamad Shahimin Wan Mokhdzani Wan Norhaimi Rajendaran Vairavan Zaliman Sauli Vithyacharan Retnasamy

The proximal interphalangeal joint (PIP) is the most important joint of the finger and is one of the most common joints to be affected by hand osteoarthritis (OA) due to excessive usage of the hand. PIP injury which may lead to osteoarthritis occurs when the protective cartilage on the boundaries of the joint begins to wear off or simply by a hyperextension of the joint. Currently, in order to diagnose joint deformity of the hand OA, particular imaging modalities namely the X-ray scanning and magnetic resonance imaging (MRI) is used but has its limitations such as radiation concerns and can be quite expensive. In this work, a fringe projection profilometry system which comprises of an LCD projector, CCD camera, and a personal computer has been developed to analyze surface changes of the PIP joint. The central concept of this optical metrology system is to apply structured light as imaging source for surface change detection. The imaging source utilizes fringe patterns generated by C++ programming and is shifted using the 3 steps 2 shift method for obtaining the phase map image. Grayscale analysis and pixel tracing were applied to detect the deformation of the PIP joint on a live individual. The result has demonstrated a successful method of PIP joint deformation detection based on the pixel tracking differences of a static and deformed state of the PIP joint.

Interphalangeal Joint

Finger joint

10.1117/12.2304770

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Citations (0)

Hydrophilicity Characterization on Cleaned Bonded Silicon Based Surface

Applied Mechanics and Materials (2014)

M. H. A. Aziz Zaliman Sauli Vithyacharan Retnasamy Wan Mokhdzani Wan Norhaimi Muammar Mohamad Isa

This paper reports on the contact angle measurement analysis on a silicon based surface for anodic bonding process cleaned by three distinct cleaning processes. The three cleaning solutions tested in this experiment were RCA, piranha and acetone. Water Droplet Test (WDT) was done to analyze the contact angle of micro droplet on sample surface. It can be done by dropping a droplet of water in constant volume at the fixed height and angle. Only RCA process constantly decreases the contact angle value after cleaning. The compilations of data strongly proved that all samples become hydrophilic after RCA cleaning process. Samples which undergo piranha and acetone cleaning did not prove any characteristic of hydrophilic or hydrophobic surface after cleaning.

Characterization

10.4028/www.scientific.net/amm.680.127

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Citations (0)

Anodic Bonding of Silicon-Pyrex and Silicon-Soda Lime Glass at Room Temperature

Advanced materials research (2014)

M. H. A. Aziz Zaliman Sauli Vithyacharan Retnasamy Hussin Kamarudin Wan Mokhdzani Wan Norhaimi

Silicon wafer bonding opens possibilities in creating MEMS devices and anodic bonding is found to be the most relevant wafer bonding technique process in constructing and packaging MEMS. This paper reports on the bond strength comparison between silicon and different glass based materials via anodic bonding. Two types of glass based surface used pyrex and soda lime glass. Bonding temperature is set at room temperature while a high direct current voltage of 15kV. Experiments were carried out using an in-house designed anodic bonder and the bond strength were measured using a bond strength tester. The anodic approach process was done in two sets which are before and after the cleaning process for each sample. Results show that all samples showed higher bond strength after the cleaning process. Silicon-soda lime glass have higher bonding strength of 1950 Pa compared to silicon-pyrex bonding which only gives 1850 Pa of bond strength.

Anodic bonding

Soda-lime glass

Bonding strength

10.4028/www.scientific.net/amr.1082.420

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Thermal Stress Comparison on Copper and Gold Wire Bonded on Aluminium Bondpad

Advanced materials research (2014)

Vithyacharan Retnasamy Zaliman Sauli Nabilah Fathiah Abd Ghani Hussin Kamarudin N. Ahmad

This paper reports on the thermal stress comparison between gold (Au) and copper (Cu) wires in wire bonding. The objective of this study is to examine the stress induced during different operating temperatures. ANSYS 11 has been deployed as the simulation tool for this study. This simulation was performed using a three dimensional (3D) non-linear finite element model. The gold and copper wires were attached to an aluminium bondpad on a silicon die. The results showed that when the highest stress concentrates at the area between the ball bond and the bondpad. Moreover, increasing temperature will increase the von mises stress. As for this study, the Cu wire display the greater thermal stress compared to Au wire due to its harder and stiffer material properties.

Ball (mathematics)

Wire bonding

10.4028/www.scientific.net/amr.1082.323

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