Chun-Pin Lin

National Applied Research Laboratories

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Chi‐Shi Chen

Taiwan Semiconductor Manufacturing Company (Taiwan)

Yuchen Hu

Tunghai University

Chien‐Ming Wu

National Taiwan University

Kuan‐Neng Chen

National Yang Ming Chiao Tung University

Chih-Ting Kuo

Taiwan Semiconductor Manufacturing Company (Taiwan)

Hsiao-Chun Chang

National Yang Ming Chiao Tung University

Chun‐Yu Chen

Michigan United

Yang Yu-Tao

Ming‐Hwa Sheu

National Yunlin University of Science and Technology

Chun-Ming Huang

National Applied Research Laboratories

Cooperative Institutions

National Applied Research Laboratories

National Yang Ming Chiao Tung University

Taiwan Semiconductor Manufacturing Company (Taiwan)

National Tsing Hua University

National Central University

National Taiwan University

Intel (Taiwan)

Industrial Technology Research Institute

National Cheng Kung University

Chang Gung University

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CIC signal processing embedded system a modulizable platform for multi-domain signal processing

Annual International Conference of the IEEE Engineering in Medicine and Biology Society (2012)

Chih-Ting Kuo Chun‐Yu Chen Yu-Tsang Chang Chun-Pin Lin Chien‐Ming Wu

IT (Information Technology) industry is well developed in IC (Integrated Circuit) design, SoC (System-on-a-Chip), embedded, and etc. in Taiwan. Most of the commonly-used platforms are not configurable or modulizable at the moment. The biomedical academia in Taiwan is eager for a flexible biomedical signal sensing platform. This paper presents a novel multi-domain nano-sensor signal processing embedded system. The platform can be tailored for different demands of biomedical signal sensing.

SIGNAL (programming language)

10.1109/embc.2012.6346557

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The design and implementation of DCT/IDCT chip with novel architecture

Kuo‐Hsing Cheng Chih-Sheng Huang Chun-Pin Lin

In the paper, an efficient VLSI architecture for a 8/spl times/8 two-dimensional discrete cosine transform and inverse discrete cosine transform (2-D DCT/IDCT) with a new 1-D DCT/IDCT algorithm is presented. The proposed new algorithm makes sure all coefficients are positive to simplify the design of multipliers and the coefficients have less round-off error than Lee's algorithm. For computing 2-D DCT/IDCT, the row-column decomposition method is used, and the design of 1-D DCT/IDCT requires only 9 multipliers and 21 adders/subtractors. This chip is synthesized with 0.6 /spl mu/m standard cell library and 1P3M CMOS technology, and it can be operated up to 100 MHz.

10.1109/iscas.2000.858858

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Citations (18)

複雑地形を有する二重自己集合法を用いた高度3D/2.5D集積パッケージングアプローチ,圧力センシングシステムのためのmicropinフィンヒートシンクインターポーザ【Powered by NICT】

IEEE Conference Proceedings (2016)

Yuchen Hu Chun-Pin Lin Hsiao-Chun Chang Yang Yu-Tao Chi‐Shi Chen

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An advanced 3D/2.5D integration packaging approach using double-self-assembly method with complex topography, and micropin-fin heat sink interposer for pressure sensing system

IEEE Conference Proceedings (2016)

Yuchen Hu Chun-Pin Lin Hsiao-Chun Chang Yang Yu-Tao Chi‐Shi Chen

Fin

Interposer

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Morpack Cube: A portable 3D heterogeneous system integration platform

Chun‐Chieh Chiu Chih-Hsing Lin Chih-Chyau Yang Shuaicheng Liu Ssu-Ying Chen

This paper proposes a portable three-dimensional (3D) heterogeneous system integration platform with reusable sockets, namely, morphing package Cube (MorPACK Cube). The architecture of MorPACK Cube platform achieves the features of miniaturization and portability without a carrier board. Our proposed MorPACK Cube integrates accelerometer sensor, gyroscope sensor and electronic compasses sensor and then exhibits on Andriod platform through Bluetooth wireless communication. Furthermore, we develop an Mobile APP, namely SigView, to display and analysis the collected data from these sensors. The proposed MorPACK Cube is used for sensor applications to demonstrate the effectiveness, compared with the total area 434cm2 obtained by implementing MorPACK Cube platform with a carrier board, the results show that there are 91.14% area cost reduced by the MorPACK Cube platform without a carrier board. Besides, around 60% performance improvement of operation frequency can be benefited from the 3D-stacking technique.

Cube (algebra)

10.1109/socc.2013.6749687

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Accuracy and safety of real-time navigation during insertion of temporary anchorage devices - A randomized clinical trial

Journal of Dental Sciences (2025)

Yi-Cheng Chen Hung‐Ying Lin Sang‐Heng Kok Hairong Chang Chun-Pin Lin

10.1016/j.jds.2025.01.026

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Thermal Changes of Dentin during Co2 Lasing

陳冠伍鄭景暉林俊彬吳秉翰藍萬烘

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A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology Node

IEEE Transactions on Electron Devices (2015)

Yuchen Hu Chun-Pin Lin Yao-Jen Chang Nien-Shyang Chang Ming‐Hwa Sheu

A novel 3-D chip-level heterogeneous integration scheme for low cost and rapid pilot demonstration is proposed in this paper. The conventional Bumping fabrication is done at wafer level. However, due to the high cost of whole wafer, opting for chips with advanced technology node is a better alternative. Therefore, with the difficulties of the bumping process at chip level, 3-D heterogeneous integration by chip stacking faces challenges. This paper presents a novel heterogeneous integration platform by using electroless plating on chips and pillar bump on wafers before stacking. This integration platform can be applied to chip-to-chip or chip-to-wafer scheme when chips are fabricated from costly advanced technology node.

Bumping

Wafer-scale integration

Wafer-level packaging

10.1109/ted.2015.2487041

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Citations (7)

A nano-sensor platform utilizes tablet computer for biomedical signal processing

Chih-Ting Kuo Chun‐Yu Chen Yu-Tsang Chang Chun-Pin Lin Chien‐Ming Wu

Traditionally, biomedical signal analysis and processing are commonly relied on voluminous instruments for signal capture and standalone computer for data processing. The mobility thus becomes an important issue for extending the applications and being applicable for specific occasions such as remote biomedical data gathering. In this article, we offer a case of utilizing tablet computer for processing biomedical signals with a specially designed wireless platform for sensing biomedical signals. According to our case, the compact tablet computers may supersede heavy instruments and laptops in many cases thus smooth the process of research. It is believed that the extended mobility of utilizing the tablet computers in research would benefit researchers in mobility-aware situations.

SIGNAL (programming language)

Data Processing

Tablet pc

10.1109/icce-berlin.2011.6031848

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3D heterogeneous integration structure based on 40 nm- and 0.18 µm-technology nodes

Yuchen Hu Chun-Pin Lin Y. F. Hsieh Nien-Shyang Chang Anthony Gallegos

In this paper, a simple process for high yield CMOS-compatible and heterogeneous integrated chip-to-chip structure without TSV is demonstrated. This scheme provides two chips consisted of the shortest interconnect path by Cu/Sn pillar bump and electroless nickel immersion gold (ENIG) pad bonding. One of the key technologies of 3D integration process is bump plating on the uneven topography. Since passivation layer covers the periphery of the top metal layer, subsequent electroplating process resulted to the increase in height of bump edge which is higher than bump center resulting in concave shape. A new and unique plating solution was developed to solve the issue during the electroplating pillar bump. Basic electrical characteristics including resistance and current leakage were investigated with reliability tests. The stable reliability tests results and excellent electrical performance show that the 3D heterogeneous integration structure is potentially applicable for 3D applications in the future.

Passivation

Three-dimensional integrated circuit

Plating (geology)

Pillar

10.1109/ectc.2015.7159817

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Citations (6)