Lili Gao

Xi'an University of Architecture and Technology

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Jun Jin

Lanzhou University

Songbai Xue

Nanjing University of Aeronautics and Astronautics

Xuefeng Long

Lanzhou University of Technology

Liang Zhang

Chinese Academy of Sciences

Jiandong Zhang

University of North Carolina at Chapel Hill

Feng Li

University of California, San Diego

Wei‐Guo Jia

Anhui Normal University

Jiantai Ma

Lanzhou University

Huan Chai

State Key Laboratory of Applied Organic Chemistry

Tianzhong Liu

Qingdao Institute of Bioenergy and Bioprocess Technology

Cooperative Institutions

Chinese Academy of Sciences

140

Taiyuan University of Technology

University of Chinese Academy of Sciences

Xi'an University of Architecture and Technology

Lanzhou University

Shanghai Jiao Tong University

Zhejiang University

Huazhong University of Science and Technology

Shandong University

Tsinghua University

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The corrosion of a novel Mg–11Li–3Al–0.5RE alloy in alkaline NaCl solution

Journal of Alloys and Compounds (2008)

Lili Gao Chunhong Zhang Milin Zhang Xiaomei Huang Nan Sheng

Pitting Corrosion

10.1016/j.jallcom.2007.12.080

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Citations (56)

Development of two-dimensional nano Mts/SA phase change materials for self-adjusting temperature of pavement

Construction and Building Materials (2022)

Limei Wu Qingxin Liu Ning Tang Xiaolong Wang Lili Gao

Stearic acid

Atmospheric temperature range

Thermal Stability

Volume fraction

10.1016/j.conbuildmat.2022.128753

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Citations (11)

Ferromagnetic MoS2 nanosheets exfoliated by oxidation intercalation and organic carbon source reduction

Materials Letters (2023)

Fan Yang Fei Yin Zhenyu Chen Zhu Fei Fairy Fan Yang

Exfoliation joint

Carbon fibers

Nanosheet

10.1016/j.matlet.2023.135514

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Citations (0)

Doping with Rare Earth Elements and Loading Cocatalysts to Improve the Solar Water Splitting Performance of BiVO4

Inorganics (2023)

Meng Wang Lan Wu Feng Zhang Lili Gao Lei Geng

BiVO4 is a highly promising material for Photoelectrochemical (PEC) water splitting photoanodes due to its narrow band gap value (~2.4 eV) and its ability to efficiently absorb visible light. However, the short hole migration distance, severe surface complexation, and low carrier separation efficiency limit its application. Therefore, in this paper, BiVO4 was modified by loading CoOOH cocatalyst on the rare earth element Nd-doped BiVO4 (Nd-BiVO4) photoanode. The physical characterization and electrochemical test results showed that Nd doping will cause lattice distortion of BiVO4 and introduce impurity energy levels to capture electrons to increase carrier concentration, thereby improving carrier separation efficiency. Further loading of surface CoOOH cocatalyst can accelerate charge separation and inhibit electron–hole recombination. Ultimately, the prepared target photoanode (CoOOH-Nd-BiVO4) exhibits an excellent photocurrent density (2.4 mAcm−2) at 1.23 V versus reversible hydrogen electrode potential (vs. RHE), which is 2.67 times higher than that of pure BiVO4 (0.9 mA cm−2), and the onset potential is negatively shifted by 214 mV. The formation of the internal energy states of rare earth metal elements can reduce the photoexcited electron–hole pair recombination, so as to achieve efficient photochemical water decomposition ability. CoOOH is an efficient and suitable oxygen evolution cocatalyst (OEC), and OEC decoration of BiVO4 surface is of great significance for inhibiting surface charge recombination. This work provides a new strategy for achieving effective PEC water oxidation of BiVO4.

Photocurrent

Charge carrier

Reversible hydrogen electrode

Oxygen evolution

10.3390/inorganics11050203

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Citations (7)

Interfacial compounds growth of SnAgCu(nano La 2 O 3 )/Cu solder joints based on experiments and FEM

Journal of Alloys and Compounds (2015)

Liang Zhang Lili Gao

10.1016/j.jallcom.2015.02.110

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Citations (49)

Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition

Journal of Alloys and Compounds (2011)

Guang Zeng Songbai Xue Lili Gao Liang Zhang Yuhua Hu

Solderability

10.1016/j.jallcom.2011.04.037

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Citations (33)

Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing

Journal of Materials Science Materials in Electronics (2021)

Mulan Li Lili Gao Liang Zhang Nan Jiang Sujuan Zhong

Shear Strength

Dewetting

10.1007/s10854-021-07044-5

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Citations (4)

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Science and Technology of Advanced Materials (2020)

Kai‐Kai Xu Liang Zhang Lili Gao Nan Jiang Lei Zhang

Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders.

Electronic Packaging

Lead (geology)

10.1080/14686996.2020.1824255

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Citations (52)

Application of Advanced Quantum Dots in Perovskite Solar Cells: Synthesis, Characterization, Mechanism, and Performance Enhancement

Materials Horizons (2025)

Meidan Que Yuan Xu Qizhao Wu Jin Chen Lili Gao

Quantum dots have garnered significant interest in perovskite solar cells (PSCs) due to their stable chemical properties, high carrier mobility, and unique features such as multiple exciton generation and excellent optoelectronic characteristics resulting from quantum confinement effects. This review explores quantum dot properties and their applications in photoelectronic devices, including their synthesis and deposition processes. This sets the stage for discussing their diverse roles in the carrier transport, absorber, and interfacial layers of PSCs. We thoroughly examine advances in defect passivation, energy band alignment, perovskite crystallinity, device stability, and broader light absorption. In particular, novel approaches to enhance the photoelectric conversion efficiency (PCE) of quantum dot-enhanced perovskite solar cells are highlighted. Lastly, based on a comprehensive overview, we provide a forward-looking outlook on advanced quantum dot fabrication and its impact on enhancing the photovoltaic performance of solar cells. This review offers insights into fundamental mechanisms that endorse quantum dots for improved PSC performance, paving the way for further development of quantum dot-integrated PSCs.

Characterization

Performance enhancement

10.1039/d4mh01478b

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Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles

Journal of Materials Research and Technology (2023)

Chen Chen Liang Zhang Xi Wang Xiao Lu Lili Gao

The mechanical mixed Sn58Bi solder reinforced by B4C nanoparticles for the interconnect of Cu/Cu same metal was studied. The hardness of solder alloy and shear strength of joints with Sn58Bi-xB4C (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) composite solder were tested. The feasibility of the solution was verified by the performance of melting characteristics, wettability, microstructure, and interfacial IMC structure. It is indicated that the proper amount of B4C nanoparticles can improve the mechanical properties of the solder joint, and the hardness of the solder alloy is decreased to 246.0 HV by 13.65% with the addition of 0.6 wt% B4C and the highest shear strength of the joint reaches 52.282 MPa, which is increased by 8.9%. The failure mode of fracture is mainly considered a brittle fracture. The preferred orientation of the β-Sn phase and Bi phase are (1 0 0) and (1 0 1), respectively, and the number of low-angle grain boundary and dislocation density are increased. The melting characteristics of the solder are less affected by B4C nanoparticles, which will not interfere with its normal use. When the amount of B4C is 0.6 wt%, the spreading area of the solder is increased by 35.44%. Besides, a moderate amount of B4C nanoparticles is able to refine the matrix structure of the solder and inhibit the growth of Cu6Sn5 IMC.

Shear Strength

Brittleness

10.1016/j.jmrt.2023.01.077

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Citations (28)