PARC, a Xerox Company, is developing a low-cost system of peel-and-stick wireless sensors that will enable widespread building environment sensor deployment with the potential to deliver up to 30% energy savings. The system is embodied by a set of RF hubs that provide power to automatically located sensor nodes, and relay data wirelessly to the building management system (BMS). The sensor nodes are flexible electronic labels powered by rectified RF energy transmitted by an RF hub and can contain multiple printed and conventional sensors. The system design overcomes limitations in wireless sensors related to power delivery, lifetime, and cost by eliminating batteries and photovoltaic devices. Sensor localization is performed automatically by the inclusion of a programmable multidirectional antenna array in the RF hub. Comparison of signal strengths while the RF beam is swept allows for sensor localization, reducing installation effort and enabling automatic recommissioning of sensors that have been relocated, overcoming a significant challenge in building operations. PARC has already demonstrated wireless power and temperature data transmission up to a distance of 20m with less than one minute between measurements, using power levels well within the FCC regulation limits in the 902–928 MHz ISM band. The sensor’s RF energy harvesting antenna achieves high performance with dimensions below 5cm × 9cm.
Fully printed radio frequency (RF) harvesters that operate at HF RFID and ISM frequency of 13.56 MHz are normally comprised of a small printed loop antenna. They work at short ranges using inductive coupling. In this paper, we present a novel screen printed large area E-field antenna incorporated with a printed organic diode rectifier that can provide close to 1 V dc voltage with 1 W input at a distance of a few meters. The unique high bulk capacitance of the printed organic diodes enables effective imaginary impedance matching to the antenna without an additional matching component. The results demonstrate the possibility of fully printed RF energy harvesters for long range operation at HF frequencies.
Solar power is widely available around the globe but efficient transfer of solar power to the load becomes a challenging task. There are various methods in which the power transfer can be done, the following work proposes a method for efficient tracking of solar power. MPPT [ maximum power point tracking] algorithm applied on three phase voltage source inverter connected to solar PV array with a three phase load. MPPT is applied on inverter rather than conventionally applying MPPT on DC-DC converter. Perturb and Observe method is applied in the MPPT algorithm to find the optimal modulation index for the inverter to transfer maximum power from the panel. Sine pulse width modulation technique is employed for controlling the switching pattern of the inverter. The algorithm is programmed for changing irradiation and temperature condition. The system does not oscillate about the MPP point as the algorithm set the system at MPP and does not vary till a variation in irradiation is sensed. The proposed system can be installed at all places and will reduce the cost, size and losses compared to conventional system.
In this paper, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an mostly printed integrated electronic system on a flexible substrate that can read and process multiple discrete sensors. Our approach is to create an integrated platform for the fabrication of mechanically flexible sensor tags that can be powered and interrogated wirelessly, precluding the need of a separate on-board power source. The high level system design is aimed at minimizing the number of non-printed components and reducing power consumption to enable energy harvesting from the RF field. Digital fabrication of these systems requires a range of materials, feature sizes, and electrical characteristics. In order to integrate the various printed components on a single substrate, we developed an integrated printer to accommodate a range of inks for printing the antenna, different types of sensors, chip interconnects, and wiring. For chip attachment to the flexible substrate, a method of integrating the die within the thickness of the substrate was developed. With proper system design and fabrication, a complete integrated tag for wireless sensing of temperature, strain, and touch was demonstrated. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures, and the environment.
Printed organic electronics are being explored for a wide range of possible applications, with much of the current focus on smart labels, wearables, health monitoring, sensors and displays. These applications typically integrate various types of sensors and often include silicon integrated circuits (IC) for computation and wireless communications. Organic thin film transistors (TFT), particularly when printed, have performance and yield limitations that must be accommodated by the circuit design. The circuit design also needs to select sensor technology, ICs and other circuit elements to integrate with the TFTs and match the functional and performance requirements of the application. This paper describes organic TFT properties and strategies for circuit and sensor design, with examples from various sensor systems.
Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost. At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.
PARC, a Xerox Company, is developing a low-cost system of peel-and-stick wireless sensors that will enable widespread building environmental sensor deployment with the potential to deliver up to 30% energy savings. The system is embodied by a set of radio-frequency (RF) hubs that provide power to automatically located sensor nodes and relay data wirelessly to the building management system (BMS). The sensor nodes are flexible electronic labels powered by rectified RF energy transmitted by the RF hub and can contain multiple printed and conventional sensors. The system design overcomes limitations in wireless sensors related to power delivery, lifetime, and cost by eliminating batteries and photovoltaic devices. Sensor localization is performed automatically by the inclusion of a programmable multidirectional antenna array in the RF hub. Comparison of signal strengths as the RF beam is swept allows for sensor localization, reducing installation effort and enabling automatic recommissioning of sensors that have been relocated. PARC has already demonstrated wireless power and temperature data transmission up to a distance of 20 m with 71 s between measurements, using power levels well within the Federal Communications Commission regulation limits in the 902–928 MHz industrial, medical and scientific (ISM) band. The sensor's RF energy harvesting antenna achieves high performance with dimensions of 5 cm × 9.5 cm.
'%3e%3ccircle r='20' fill='%23008'/%3e%3ccircle r='17.5' fill='%23fff'/%3e%3ccircle r='3.5' fill='%23008'/%3e%3cg id='d'%3e%3cg id='c'%3e%3cg id='b'%3e%3cg id='a' fill='%23008'%3e%3ccircle r='.875' transform='rotate(7.5 -8.75 133.5)'/%3e%3cpath d='M0 17.5.6 7 0 2l-.6 5L0 17.5z'/%3e%3c/g%3e%3cuse xlink:href='%23a' transform='rotate(15)'/%3e%3c/g%3e%3cuse xlink:href='%23b' transform='rotate(30)'/%3e%3c/g%3e%3cuse xlink:href='%23c' transform='rotate(60)'/%3e%3c/g%3e%3cuse xlink:href='%23d' transform='rotate(120)'/%3e%3cuse xlink:href='%23d' transform='rotate(-120)'/%3e%3c/g%3e%3c/svg%3e)