Yi‐Shao Lai

Advanced Semiconductor Engineering (Taiwan)

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Chang-Lin Yeh

Kaohsiung Medical University

Tong Hong Wang

Chang Gung Memorial Hospital

Ying-Ta Chiu

Advanced Semiconductor Engineering (Taiwan)

Ping‐Feng Yang

Advanced Semiconductor Engineering (Taiwan)

Jenn‐Ming Song

National Chung Hsing University

Chang-Chi Lee

Feng Chia University

Bernd K. Appelt

Evans Analytical Group (United States)

Sheng‐Rui Jian

I-Shou University

Hsiao‐Chuan Chang

ITRI International

Andy Tseng

ON Semiconductor (United States)

Cooperative Institutions

Advanced Semiconductor Engineering (Taiwan)

National Cheng Kung University

National Yang Ming Chiao Tung University

National Tsing Hua University

National Sun Yat-sen University

National Taiwan University

I-Shou University

National Chung Hsing University

University of California, Los Angeles

National Taipei University

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Thermal characteristics evaluation for board-level high performance flip-chip package equipped with vapor chamber as heat spreader

Microelectronic Engineering (2010)

Tong Hong Wang Chang-Chi Lee Yi‐Shao Lai

Ball grid array

Electronic Packaging

Thermal grease

10.1016/j.mee.2010.05.002

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Citations (17)

Effect of Multiple Reflow Cycles on Ball Impact Responses of Sn-4Ag-0.5Cu Solder Joints with Immersion Tin Substrate Pad Finish

Yi‐Shao Lai C. R. Kao Hsiao‐Chuan Chang Shu-Hua Lee Chin-Li Kao

We report in this work the effect of multiple reflow cycles on ball impact test (BIT) responses and fractographies obtained at an impact velocity of 500 mm/s on Sn-4Ag-0.5 Cu solder joints. Solder balls were mounted on Cu substrate pads with immersion tin surface finish, supplied by two vendors. For these particular test vehicles and test conditions, fracture near the interface between the interfacial Cu ₆ Sn ₅ intermetallic compound (IMC) and Cu pad was identified as the only failure mode induced by BIT. Measurement results indicate that BIT characteristics in general degrade as the number of reflow cycles increases. Furthermore, scanning electron microscopy observations show that the thickness and grain size of interfacial Cu ₆ Sn ₅ increase with increasing number of reflow cycles. This correlation confirms the familiar notion that a thicker Cu ₆ Sn ₅ degrades the interfacial strength.

Ball (mathematics)

10.1109/impact.2008.4783806

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Citations (1)

Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique

International Conference on Electronic Materials and Packaging (2006)

Hsiang‐Chen Hsu Yu-Chia Hsu Hui-Yu Lee Chang-Lin Yeh Yi‐Shao Lai

The objective of this research is to investigate the effects of board-level drop test based on the support excitation scheme incorporated with the submodel technique for stacked-die packages. Three lead-free materials, namely SAC405 (Sn4Ag0.5Cu), SAC387(Sn3.8Ag0.7Cu) and Sn3.5Ag were used to demonstrate the transient dynamic response for solder balls subject to JEDEC pulse-controlled board-level drop test standard JESD22-B110A Condition B[1]. The support excitation scheme was developed and applied to examine the transient dynamic response for it produces no rigid-body motion to the test vehicle and dramatically reduces the computational cost. In order to evaluate the structure of the interested area, a strip model sliced from the full test vehicle is used in this research. In addition, the submodel region is particularly chosen with strip model by performing the cut boundary interpolation. The envelope of equivalent stress for the outermost solder joint off the end of the strip model is plot to show the potential solder failure mode and mechanism. The cut boundary of submodel is verified and the mesh density of submodel is examined. For a refinery mesh of submodel, parametric studies are carried out to study the reliability of the outermost solder joint, and the results are summarized as design rules for the development of stacked-die packages.

Drop Impact

Drop test

10.1109/emap.2006.4430622

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Citations (1)

Electromigration Reliability with Respect to Cu Content in Solder Joint System

Yi‐Shao Lai Jenn‐Ming Song

Observations from assorted current stressing experiments on flip-chip solder joints imply that the Cu content in a solder joint system plays a dominant role in its electromigration reliability. In this paper, electromigration reliability of various flip-chip solder joint systems including different substrate pad finishes and solder compositions is summarized to demonstrate the effect of the Cu content. A unified failure mechanism is proposed based on morphologies observed in the current-stressed solder joints with different substrate pad finishes and different solder compositions.

Electromigration

10.1109/eptc.2008.4763586

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Citations (3)

Quantitative X-ray microtomography study of 3-D void growth induced by electromigration in eutectic SnPb flip-chip solder joints

Scripta Materialia (2011)

Tian Tian Kai Chen Alastair A. MacDowell Dula Parkinson Yi‐Shao Lai

Electromigration

Void (composites)

10.1016/j.scriptamat.2011.07.002

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Citations (40)

Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

Journal of materials research/Pratt's guide to venture capital sources (2010)

Jenn‐Ming Song Chien-Wei Su Yi‐Shao Lai Ying-Ta Chiu

Work hardening

Microelectronics

Hardening (computing)

10.1557/jmr.2010.0081

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Citations (15)

Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints

Jenn‐Ming Song Chien-Wei Su Yi‐Shao Lai Ying-Ta Chiu

This study evaluated room temperature creep properties of the intermetallic compounds (IMCs) formed at the interfaces between Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the commonly used electronic substrates (Cu, Ni and Ag) using nanoindentation. The creep stress exponent (CSE), representing creep resistance, in the decreasing order was Cu, Ni and then Ag based IMCs, which was in good agreement with tendencies of the work hardening exponent (n) and the ratio of yield stress (Y) to Young's modulus (E) as well.

Exponent

Work hardening

10.1109/impact.2009.5382227

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Citations (0)

2007 Int J Impact Eng High G Drop AuthorCopy

S.T. Jenq Haw-Yang Sheu Chang-Lin Yeh Yi‐Shao Lai J.D. Wu

Source

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Citations (0)

In-situ observation of material migration in flip-chip solder joints under current stressing

Journal of Electronic Materials (2006)